Manufacturing Advanced Coatings for Future Electronic Systems
Printed circuit board manufacturing demands continue to increase, requiring better reliability, enhanced performance and reduced environmental impact. The MACFEST project will address these issues in the development of improved solderable coatings which are made available due to novel applications techniques based on the use of ionic liquids.
Au Ball Wire Bonding
The use of ionic liquids as a replacement technology for harsh chemicals is gaining popularity. Often ionic liquids are much less toxic and hazardous than their counterparts, allowing companies to meet the escalating regulations and restrictions placed on chemicals within the EU. Ionic liquids can also often achieve the same (or better) end results, while operating at lower temperatures and with lower energy requirements, helping to reduce to manufacturing carbon footprints.
The MACFEST project will utilise the properties of ionic liquids and produce solderable finishes with improved joint reliability. This project will develop new ionic liquid-based nickel-palladium-gold solderable coatings that can provide the enhanced performance required in mission ciritical applications. Alongside the environmental benefits ionic liquids have also demonstrated the ability to provide significant improvements in coating quality, integrity and solder joint reliability. This advanced process will assist with electronics manufacturing where components and boards are becoming smaller and more densely populated, and with the development of 3D structures. The MACFEST process has the potential to cut an SMEs CO2 production by up to 8 tons per annum, saving in excess of 10,000 kWh of power per SME per year.